DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | 엄윤용 | - |
dc.contributor.advisor | Earmme, Youn-Young | - |
dc.contributor.author | 황효균 | - |
dc.contributor.author | Hwang, Hyo-Kune | - |
dc.date.accessioned | 2011-12-14T06:33:11Z | - |
dc.date.available | 2011-12-14T06:33:11Z | - |
dc.date.issued | 1998 | - |
dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=133443&flag=dissertation | - |
dc.identifier.uri | http://hdl.handle.net/10203/44990 | - |
dc.description | 학위논문(석사) - 한국과학기술원 : 기계공학과, 1998.2, [ vii, 59 p. ] | - |
dc.language | kor | - |
dc.publisher | 한국과학기술원 | - |
dc.subject | 리드프레임 | - |
dc.subject | 칩 | - |
dc.subject | 계면파괴인성치 | - |
dc.subject | 에폭시 접착제 | - |
dc.subject | Epoxy adhesive | - |
dc.subject | Lead frame | - |
dc.subject | Chip | - |
dc.subject | The interfacial fracture toughness | - |
dc.title | 칩과 리드프레임 사이의 계면파괴인성치 측정 | - |
dc.title.alternative | A measurement of the interfacial fracture toughness between chip and lead frame | - |
dc.type | Thesis(Master) | - |
dc.identifier.CNRN | 133443/325007 | - |
dc.description.department | 한국과학기술원 : 기계공학과, | - |
dc.identifier.uid | 000963674 | - |
dc.contributor.localauthor | 황효균 | - |
dc.contributor.localauthor | Hwang, Hyo-Kune | - |
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