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Results 7961-7970 of 8000 (Search time: 0.014 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
7961
Effects of Process Variation on Signal Integrity for High Speed Differential Signaling on Package Level

Kim, Joungho; Ahn, Seungyoung; Lu, Albert Chee W.; Fan, Wei; Wai, Lai L., IEEE 4th Electronics Packaging Technology Conference, pp.249 - 252, IEEE, 2002-12

7962
Over GHz Frequency Model of Commercial 2mm Hard Metric Connector using On-board Calibration Standards

Kim, Joungho; Baek, S; Park, BC; Kam, DG, IEEE 4th Electronics Packaging Technology Conference, pp.189 - 193, IEEE, 2002-12

7963
Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system

Jeong, Youchul; Kim, Hyungsoo; Kim, Jingook; Park, Jongbae; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.199 - 202, IEEE, 2003-10-27

7964
Polylithic Integration of SAW Devices using Quartz-on-Silicon Process for True Single Chip Radio

Ku, Yeonwoo; Eo, Yunseong; Lee, Kwyro, 2001 6th International Conference Solid-State and Integrated Circuit Technology, pp.236 - 239, 2001 6th International Conference Solid-State and Integrated Circuit Technology, 2001-10

7965
Prediction and Verification of Power/Ground Plane Edge Radiation Excited by Through-Hole Signal Via Based on Balanced TLM and Via Coupling Model

Pak, Jun So; Lee, Junwoo; Kim, Hyungsoo; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.181 - 184, IEEE, 2003-10-27

7966
Fast & cost effective cache invalidation in DSM

Park, Kyu Ho; Lee, C.K.; Choi, J.H.; Kim, B.W., Proceedings of 2000 International Conference on Parallel and Distributed Systems, ICPADS, 2000-07

7967
Investigation of Plane-to-Plane Noise Coupling through Cutout in Multi-layer Power/Ground Planes

Kim, Joungho; Lee, Junwoo; Seng, Yeo Mui; Iyer, Mahadevan K, IEEE 4th Electronics Packaging Technology Conference, pp.257 - 260, IEEE, 2002-12

7968
A Quadrature Signal Generator Using PLL Technique

Lee, Dong Ho; Kim, Chung-Hwan; Hong, Songcheol, The European Microwave Conference, pp.777 - 780, IEEE, 2003-10

7969
Compensation of ESD and Input Capacitance Effect by Using Package Bond-wire Inductance for Over Gbps Differential SerDes Devices

Ahn, Seungyoung; Park, Jongbae; Chung, Daehyun; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.159 - 162, IEEE, 2003-10-27

7970
Korean national Research program on Brain neuroinformatics

Lee, Soo-Young, International Conference on Neural Information Processing, pp.2013 - 2016, International Conference on Neural Information Processing, 2002-11

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