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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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A Fast and Efficient Modeling Method for Chip-Package-PCB Hierarchical Power Distribution Network Kim, Joungho; Kim, Jaemin; Shim, Jongjoo; Pak, JunSo, IEEE Electrical Design of Advanced Packaging and Systems Symposium, 2008 | |
A 6.4Gbps On-chip Eye Opening Monitor Circuit for Signal Integrity Analysis of High Speed Channel Kim, Joungho; Shin, Mincheol; Shim, Jongjoo; Kim, Jaemin; Pak, Jun So; Hwang, Chulsoon; Yoon, Changwook; Kim, Hyungsoo; Park, Kunwoo; Kim, Yongju, Presented at Proceeding of 2008 IEEE EMC Symposium, pp.1 - 7, 2008-08 | |
Analysis and Modeling of Delay and Crosstalk in Differential Meander Delay Line on Based on A Time Domain Mode Impedances Kim, Joungho; Kim, Gawon; Kim, Jaemin; Lee, Sangrok, IEEE Electrical Design of Advanced Packaging and Systems Symposium, 2008 | |
Modeling of Chip-Package-PCB Hierarchical Power Distribution Network based on Segmentation Method Kim, Jaemin; Shim, Jongjoo; Pak, Junso; Kim, Joungho, Electrical Design of Advanced Packaging and Systems Symposium, 2008. EDAPS 2008., pp.85 - 88, IEEE, 2008-12-11 |
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