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Results 11-19 of 19 (Search time: 0.003 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Noise isolation modeling and experimental validation of power distribution network in chip-package Park, H.; Yoon, C.; Koo, K.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09 | |
| Noise figure degradation analysis of power/ground noise on 900MHz LNA for UHF RFID Koo, K.; Park, H.; Shim, Y.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.416 - 420, IEEE, 2007-12-12 | |
| Analysis of the effect of AC noise on DC bias of VGA for UHF RFID using chip-package co-modeling and simulation Lee, H.; Shim, Y.; Park, H.; Ryu, C.; Yoon, C.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.591 - 594, IEEE, 2007-12-12 | |
| Electrical characterization of Trough Silicon Via (TSV) depending on structural and material parameters based on 3D full wave simulation Pak, J.S.; Ryu, C.; Kim, Joungho, International Conference on Electronic Materials and Packaging, EMAP 2007, IEEE, 2007-11-19 | |
| Design of UWB transceiver SiP for short range communication Yoon, C.; Park, H.; Kim, Joungho; Lee, J.; Park, Y., IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09 | |
| Noise isolation in LTCC-based X/Ku-band transceiver SiP using double-stacked electromagnetic bandgap structure Park, J.; Kim, J.; Lu A.C.W.; Shim, Y.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09 | |
| Development and evaluation of 3-D SiP with vertically interconnected Through Silicon Vias (TSV) Jang, DM; Ryu, C; Lee, KY; Cho, BH; Kim, Joungho; Oh, TS; Lee, Won-Jong; Yu, Jin, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.847 - 852, IEEE, 2007-05-29 | |
| Modeling and verification to analyze effect of power/ground noises on CMOS feedback operational amplifier Shim, Y.; Park, J.; Shim, J.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 7, IEEE, 2007-07-09 | |
| Power/ground Noise Immunity Test in Wireless and High-speed UWB Communication System Kim, Joungho; Yoon, Changwook; Park, Hyunjeong; Lee, Woojin; Shin, Minchul; Pak, Jun So, IEEE Electromagnetic Compatibility Symposium, EMC, pp.1 - 6, 123, 2007-12 |
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