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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Noise isolation modeling and experimental validation of power distribution network in chip-package Park, H.; Yoon, C.; Koo, K.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09 | |
Noise figure degradation analysis of power/ground noise on 900MHz LNA for UHF RFID Koo, K.; Park, H.; Shim, Y.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.416 - 420, IEEE, 2007-12-12 | |
Analysis of the effect of AC noise on DC bias of VGA for UHF RFID using chip-package co-modeling and simulation Lee, H.; Shim, Y.; Park, H.; Ryu, C.; Yoon, C.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.591 - 594, IEEE, 2007-12-12 | |
Design of UWB transceiver SiP for short range communication Yoon, C.; Park, H.; Kim, Joungho; Lee, J.; Park, Y., IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09 |
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