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Results 11-15 of 15 (Search time: 0.003 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| 10Gbps backplane design methodology with sensitivity analysis and statistical analysis Kim, J.; Baek, S.; Park, H.; Kim, S.; Hong, Y.; Lim, D.; Kim, Joungho, 7th Electronics Packaging Technology Conference, EPTC 2005, pp.38 - 42, IEEE, 2005-12-07 | |
| Chip-package co-design of power distribution network for system-in-package applications Kim, G.; Kam, D.G.; Chung, D.; Kim, Joungho, 6th Electronics Packaging Technology Conference, EPTC 2004, pp.499 - 501, IEEE, 2005-12-08 | |
| Frequency behavior of embedded epoxy/SrTiO3 composite capacitor materials Lee, S; Hyun, JG; Park, H; Kim, Joungho; Paik, Kyung-Wook, The 55th Electronic Components and Technology Conference, ECTC, pp.1222 - 1227, IEEE, 2005-05-31 | |
| Noise generation, coupling, isolation, and EM raidaiton in high-speed package and PCB Kim, Joungho; Pak, J.; Park, J.; Kim, H., IEEE International Symposium on Circuits and Systems 2005, ISCAS 2005, pp.5766 - 5769, IEEE, 2005-05-23 | |
| A 2-dimensional distributed equivalent circuit model of EBG power distribution network Lee, Junho; Jeong, Youchul; Kim, Joungho, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, pp.115 - 118, IEEE, 2005-10-24 |
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