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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| High-frequency Electrical Model of Chip-to-Chip Via Interconnection for 3-D Chip Stacking Package Kim, Joungho; Ryu, Chunghyun; Chung, Daehyun; Lee, Junho; Lee, Kwangyong; Oh, Taesung, IEEE 14th(13) Topical Meeting on Electrical Performance of Electronic Packaging, pp.151 - 154, IEEE, 2005-10 | |
| Data-dependent Jitter using Single Pulse Analysis Method in High-speed Interconnection Kim, Joungho; Song, Eakhwan; Lee, Junho; Kim, Jingook; Kam, Dong Gun; Ryu, Chunghyun, 7th EPTC 2005, pp.810 - 813, 2005 | |
| A 2-dimensional distributed equivalent circuit model of EBG power distribution network Lee, Junho; Jeong, Youchul; Kim, Joungho, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, pp.115 - 118, IEEE, 2005-10-24 |
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