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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| 3 GHz Wide Frequency Model of Ferrite Bead for Power/Ground Noise Simulation of High-speed PCB Kim, Joungho; Kim, Tae Hong; Lee, Junho; Kim, Hyungsoo, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.217 - 220, IEEE, 2002 | |
| Design Comparison of I/O Port Ground and Power Plane for Enhanced ESD Immunity Kim, Joungho; Lee, Junho; Kim, Tae Hong; Kim, Hyungsoo; Ryu, Woonghwan; Choi, Jae Chun, EMC Europe 2002 International Symposium on Electromagnetic Compatibility, 2002 | |
| Tapered Slot Shape on Slotted Reference Plane of Multi-layer PCB for Reduction of Crosstalk and Radiated Emission Kim, Joungho; Kim, Jingook; Kim, Hyungsoo; Jeong, Youchul, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.275 - 278, IEEE, 2002 | |
| Analysis of Via Distribution Effect on Multi-layered Power/Ground Transfer Impedance of High-performance Packages Kim, Joungho; Kim, Hyungsoo; Kim, Jingook; Jeong, Youchul; Park, Jongbae, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.171 - 174, IEEE, 2002-10 | |
| An Efficient Hybrid Transmission Line Method (HTLM) for Analysis of Perforated Package Power/Ground Plane Kim, Joungho; Jeong, Youchul; Kim, Hyungsoo; Kim, Jingook; Park, Jongbae, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.179 - 183, IEEE, 2002-10 |
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