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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Design Comparison of I/O Port Ground and Power Plane for Enhanced ESD Immunity Kim, Joungho; Lee, Junho; Kim, Tae Hong; Kim, Hyungsoo; Ryu, Woonghwan; Choi, Jae Chun, EMC Europe 2002 International Symposium on Electromagnetic Compatibility, 2002 | |
| A Low-Cost and High-density RF Multi-chip Module Tranceiver For 1.8 GHz Personal Communication Service Kim, Joungho; Ryu, Woonghwan; Kim, Jonghoon; Kim, Namhoon; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Sungil; Song, Hangok; Lee, Seungho, IEEE ECTC Conference, IEEE, 2000 | |
| Seperated Role of On-chip and On-PCB Decoupling Capacitors on reduction of radiated Emission on Printed Circuit Board Kim, Joungho; Kim, Jonghoon; Choi, Baekyu; Kim, Hyungsoo; Ryu, Woonghwan; Yun, Younghwan; Ham, Seog-heon; Lee, Yonghee, 2001 IEEE International Symposium on Electromagnetic Compatibility, IEEE, 2001 |
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