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Results 211-220 of 230 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Analysis of external force dependent lumped RLGC model of high-bandwidth and high-density silicone rubber socket Park, Junyong; Kim, Hyesoo; Kim, Youngwoo; Kim, Jonghoon J; Bae, Bumhee; Kim, Joungho; Ha, Dongho; Bae, Michael, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.54 - 57, Institute of Electrical and Electronics Engineers Inc., 2015-12 | |
| Design of an on-interposer passive equalizer embedded on a ground plane for 30Gbps serial data transmission Jeon, Yeseul; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Youngwoo; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.50 - 53, Institute of Electrical and Electronics Engineers Inc., 2015-12 | |
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Park, Junyong; Kim, Jiseong, 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016, pp.450 - 454, Institute of Electrical and Electronics Engineers Inc, 2016-07-27 | |
| Modeling and analysis of a conductive rubber contactor for package test Kim, Hyesoo; Bae, Bumhee; Kim, Jonghoon J; Park, Junyong; Ha, Dongho; Bae, Michael; Kim, Joungho, 17th IEEE Electronics Packaging and Technology Conference, EPTC 2015, Institute of Electrical and Electronics Engineers Inc., 2015-12 | |
| Signal and power integrity design of 2.5D HBM (High bandwidth memory module) on SI interposer Cho, Kyungjun; Lee, Hyunsuk; Kim, Joungho, Pan Pacific Microelectronics Symposium, Pan Pacific 2016, Institute of Electrical and Electronics Engineers Inc., 2016-01 | |
| A fast statistical eye-diagram estimation method for high-speed channel including non-linear receiver circuit Kim, Hee-Gon; Kim, Kiyeong; Kim, Jingook; Yoon, Changwook; Kim, Hyungsoo; Kim, Jonghoon J; Kim, Joungho, DesignCon 2015, UBM Electronics, 2015-01 | |
| Electromagnetic noise effects on semiconductor system in electric vehicle Bae, Bumhee; Kim, Jonghoon J; Kim, Sukjin; Kong, Sunkyu; Jung, Daniel H; Kim, Joungho, DesignCon 2015, UBM Electronics, 2015-01 | |
| Temperature-Dependent Through-Silicon Via (TSV) Model and Noise Coupling Lee, Manho; Cho,Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Park, Kunwoo, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 | |
| Through-Silicon Via (TSV) Depletion Effect Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Pak, Kunwoo, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 | |
| Modeling of Simultaneous Switching Noise Effects on Jitter Characteristics of Delay Locked Loop in a Hierarchical System of Chip-Package-PCB Shim, Yujeong; Bae, Bumhee; Koo, Koungchoul; Kim, Joungho, 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2011, 2011-11-07 |