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Results 11-20 of 230 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Estimation of Vertical Noise Coupling on 900MHz Low Noise Amplifier from 200MHz On-chip Switching-mode Power Supply in 3D-IC Koo, Kyoungchoul; Kim, Myunghoi; Lee, Sangrok; Kim, Joungho, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17 | |
| Electrical Performance of 3D TSV Channel and 3D Stacked PDN based on Hierarchical Models Pak, Jun So; Kim, Joohee; Cho, Jonghyun; Kim, Heegon; Kim, Joungho, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011-03-01 | |
| Basic Analysis of Signal and Power Integrity of TSV Applications Pak, Jun So; Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Kim, Joungho, 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012-05-18 | |
| Power/Ground Noise Mitigation Using Z-shape Partial Electromagnetic Bandgap (ZP-EBG) Structure for Ultra-Wideband (UWB) System Kim, M; Yoon, C; Lee, W; Sung, H; Kim, Joungho, 2010 Asia-Pacific Radio Science Conference, 2010 Asia-Pacific Radio Science Conference, 2010-12-30 | |
| Design and Analysis of On-interposer Active Power Dsitribution Network for an Efficient Simultaneous Switching Noise Kim, Joungho; Cho, Kyungjun; Song, Jinwook, IEEE International Conference on 3D Systems Integration (3D IC 2016), IEEE International Conference on 3D Systems Integration (3D IC 2016), 2016-11-11 | |
| Suppression of Power Distribution Network(PDN) Resonances in Glass Interposer Kim, Joungho; Kim, Youngwoo; Cho, Jonghyun, Global Interposer Workshop 2013, Global Interposer Workshop 2013 in Georgia Institute of Technology, 2013-11-17 | |
| Power and Signal Integrity Analysis of Fan-out Wafer Level Package for Mobile Application Processor Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Kim, Subin; Kang, Kibum; So, Kwangsup; Jeon, Jiwon; Kim, Chungju; Paik, Woohyun, DesignCon 2017, DesignCon 2017, 2017-01-31 | |
| Modeling, Measurement, and Analysis of TSV Channel and Defects for 2.5D/3D IC Failure Analysis Kim, Joungho; Jung, Daniel H; Bae, Hyun-Cheol; Choi, Kwang-Seong; Youn, Joong Suk, DesignCon 2017, DesignCon 2017, 2017-02-01 | |
| Magnetically-Coupled Current Probing Structures and Method for Reconstruction of Switching Current Kim, Joungho; Kim, Jonghoon J.; Kim, Heegon; Cho, Chang Hyun, DesignCon 2017, DesignCon 2017, 2017-02-01 | |
| Design and analysis of high bandwidth memory (HBM) interposer Considering Signal and Power integirty (SI/PI) for terabyte/s bandwidth system Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Kim, Heegon; Kim, Youngwoo; Choi, Sumin; Kim, Subin; Kim, Hyungsoo, DesignCon 2017, DesignCon 2017, 2017-02-01 |