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Results 1-10 of 18 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| High Efficiency Wireless Power Transfer System using a Two-stack Hybrid Metamaterial Slab Lee, Seongsoo; Cho, Yeonje; Jeong, Seung Taek; Hong, Seokwoo; Sim, Boogyo; Kim, Hongseok; Kim, Joungho, 2019 IEEE Wireless Power Transfer Conference, WPTC 2019, pp.616 - 619, Institute of Electrical and Electronics Engineers Inc., 2019-06 | |
| Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box Son, Kyungjune; Choi, Sumin; Jung, Daniel Hyunsuk; Kim, Keunwoo; Park, Gapyeol; Lho, Daehwan; Park, Hyunwook; Park, Shinyoung; Kim, Joungho; Cho, Youngje; Park, Byungsoo; Choi, Seongmin, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 | |
| Design and analysis of flexible interconnects on an extremely thin silicon substate for flexible wearable devices Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Park, Shinyoung; Park, Hyunwook; Kim, Joungho; Lee, Jae Hak; Song, Jun Yeob, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.387 - 390, Institute of Electrical and Electronics Engineers Inc., 2019-06 | |
| Design and analysis of an active simultaneously switching output noise reduction scheme Park, Shinyoung; Kim, Subin; Shin, Taein; Kim, Joungho, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.222 - 225, Institute of Electrical and Electronics Engineers Inc., 2019-06 | |
| Analytical Expressions of Differential-mode Harmonics in Loosely-coupled Series-resonant Wireless Power Transfer System Kim, Hongseok; Fan, Jun; Lee, Seongsoo; Hong, Seokwoo; Sim, Boogyo; Kim, Joungho, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.648 - 653, Institute of Electrical and Electronics Engineers Inc., 2019-07 | |
| Design methodology of passive equalizer for GDDR6 memory test Kim, Subin; Kim, Seongguk; Kim, Hyesoo; Cho, Kyungjun; Kim, Joungho, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.270 - 273, Institute of Electrical and Electronics Engineers Inc., 2019-06 | |
| Modeling, simulation and measurement of on-chip interconnects with extremely thin Si substrate for flexible electronics Jeong, Seungtaek; Lee, Seongsoo; Sim, Boogyo; Hong, Seokwoo; Park, Hyunwook; Kim, Subin; Kim, Joungho; Lee, Jaehak; Song, Junyeop, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 | |
| Design and analysis of high-definition multimedia interface connectors considering signal integrity Kumar, Gaurav; Park, Gapyeol; Park, Hyunwook; Lho, Daehwan; Park, Junyong; Kim, Joungho; Lee, Junho; Choi, Seongmin, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 | |
| Modeling and verification of 3-dimensional resistive storage class memory with high speed circuits for core operation Son, Kyungjune; Cho, Kyungjun; Kim, Subin; Park, Shinyoung; Park, Gap Yeol; Kim, Seongguk; Shin, Taein; Kim, Joungho, 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019, pp.694 - 696, Institute of Electrical and Electronics Engineers Inc., 2019-12 | |
| Design and Analysis of Double-Eight Shaped Shielding Coil for Solenoid Coil in Loosely-Coupled Wireless Power Transfer System Sim, BooGyo; Jeong, Seung Taek; Lee, Seongsoo; Hong, Seokwoo; Kim, Hongseok; Kim, Joungho, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.639 - 643, Institute of Electrical and Electronics Engineers Inc., 2019-07 |
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