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Results 1-10 of 28 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Park, Junyong; Kim, Heegon; Bae, Bumhee; Jung, Daniel H; Ha, Dongho; Bae, Michael, DesignCon 2016, DesignCon 2016, 2016-01-19 | |
| Resonance and EMI in vertical multi-coupled coils for wireless power transfer (WPT) system Kong, Sunkyu; Kim, Jonghoon J; Kim, Joungho, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, 2012-05-11 | |
| How to Improve Power Integrity on Analog-to-Digital Converter (ADC) with Chip-PCB Hierarchical Structure Kim, Joungho; Bae, Bumhee; Cho, Jonghyun; Kong, Sunkyu; Kim, Jonghoon J; Shim, Yujeing, 2013 Design Con, 2013 Design Con, 2013-01-31 | |
| Design of Contactless Wafer-level TSV Connectivity Testing Structure using Capacitive Coupling Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Kim, Sukjin; Bae, Bumhee; Jung, Daniel H; Kong, Sunkyu; Lee, Junho; Park, Kunwoo, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.158 - 162, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 | |
| Near-Field Intensity Prediction Model at Maximum Transferred Power Frequency in Mutual-coupled Rectangular Coils for WPT System Kong, Sunkyu; Kim, Jonghoon J; Park, Laehyuk; Park, Unkyoo; Kim, Ji Seong; Kim, Joungho, 2012 Asia-Pacific Symposium on Electromagnetic Compatibility, AP-EMC 2012, 2012 Asia-Pacific Symposium on Electromagnetic Compatibility, AP-EMC 2012, 2012-05-22 | |
| Design and Implementation of Magnetically Coupled Current Probe for Monitoring Simultaneous Switching current in Package Kim, Joungho; Cho, Changhyun; Cho, Jonghyun; Kim, Jonghoon J; Pak, Jun so, 14th Electronics Packaging Technology Conference (EPTC), EPTC2012, 2012-12-05 | |
| Frequency and Time Domain Measurement of Through-Silicon Via (TSV) Failure Jung, Daniel H; Kim, Joohee; Kim, Heegon; Kim, Jonghoon J; Kim, Joungho; Pak, Jun So, Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23 | |
| Design and Measurement of a Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Differential Signaling Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Jung, Daniel H; Kim, Jonghoon J; Choi, Sumin; Lee, Junho; Park, Kunwoo, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.5 - 9, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 | |
| Electromagnetic Interference Shielding Effects in Wireless Power Transfer using Magnetic Resonance Coupling for Board-to-Board Level Interconnection Kim, Joungho; Kim, Sukjin; Kim, Hongseok; Kim, Jonghoon J; Bae, Bumhee; Kong, Sunkyu, 2013 IEEE Electromagnetic Compatibility Symposium, pp.773 - 778, 2013 IEEE Electromagnetic Compatibility Symposium, 2013-08-08 | |
| Design, Implementation and Measurement of Board-to-Board Wireless Power Transfer (WPT) for Low Voltage Applications Kim, Joungho; Kim, Sukjin; Bae, Bumhee; Kong, Sunkyu; Jung, Daniel H; Kim, Jonghoon J, 22nd Conference on Electrical Performance of Electronic Packaging and Systems(EPEPS2013), 22nd Conference on Electrical Performance of Electronic Packaging and Systems, 2013-10-29 |