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Results 1-10 of 31 (Search time: 0.008 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Design and Analysis of On-interposer Active Power Dsitribution Network for an Efficient Simultaneous Switching Noise Kim, Joungho; Cho, Kyungjun; Song, Jinwook, IEEE International Conference on 3D Systems Integration (3D IC 2016), IEEE International Conference on 3D Systems Integration (3D IC 2016), 2016-11-11 | |
| Power and Signal Integrity Analysis of Fan-out Wafer Level Package for Mobile Application Processor Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Kim, Subin; Kang, Kibum; So, Kwangsup; Jeon, Jiwon; Kim, Chungju; Paik, Woohyun, DesignCon 2017, DesignCon 2017, 2017-01-31 | |
| Design and analysis of high bandwidth memory (HBM) interposer Considering Signal and Power integirty (SI/PI) for terabyte/s bandwidth system Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Kim, Heegon; Kim, Youngwoo; Choi, Sumin; Kim, Subin; Kim, Hyungsoo, DesignCon 2017, DesignCon 2017, 2017-02-01 | |
| Electrical Performance Analysis of Low-Cost and Ultra-Thin Glass Interposer: Advantages, Challenges and Solutions Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Park, Shinyoung; Ahn, Seungyoung, DesignCon 2018, DesignCon 2018, 2018-01-31 | |
| Hierarchical Power Distribution Network Design in Fanout Wafer Level Package based Mobile AP-GPU for Multi-Media System Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Kim, Subin, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 | |
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; Jeong, Seungtaek; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 | |
| Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Son, Kyungjune; Park, Hyunwook; Kim, Joungho; Watanabee, Atom; Raj, Pulugurtha Markondeya; Sundaram, Venky; Tummala, Rao, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.107 - 109, IEEE, 2018-10-15 | |
| Electrical Performance Analysis of Glass Interposer Channel and Power Distribution Network Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Jeong, Seungtaek; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.3 - 5, IEEE, 2018-10-15 | |
| Reinforcement Learning-based Optimal On-board Decoupling Capacitor Design Method Park, Hyunwook; Park, Junyong; Kim, Subin; Lho, Daehwan; Park, Shinyoung; Park, Gapyeol; Cho, Kyungjun; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.213 - 215, IEEE, 2018-10-15 | |
| Estimation and Analysis of Crosstalk Effects in High-Bandwidth Memory Channel Choi, Sumin; Kim, Heegon; Park, Junyong; Kim, Dong-Hyun; Jung, Daniel H; Lim, Jaemin; Cho, Kyungjun; Kim, Joungho, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), pp.4 - 4, IEEE EMC & APEMC, 2018-05-16 |