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Results 11-18 of 18 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A Dual Resonance near Field Communication Coil for EMF Reduction in near Field Communication and Wireless Power Transfer Dual Coil System Hong, Seokwoo; Jeong, Seung Taek; Lee, Seong Soo; Sim, BooGyo; Kim, Hongseok; Kim, Joungho, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.644 - 647, Institute of Electrical and Electronics Engineers Inc., 2019-07 | |
| Bayesian Optimization of High-Speed Channel for Signal Integrity Analysis Lho, Daehwan; Park, Junyong; Park, Hyunwook; Park, Shinyoung; Kim, SeongGuk; Kang, Hyungmin; Kim, Subin; Park, Gap Yeol; Son, Kyungjune; Kim, Joungho, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 | |
| Power integrity comparison of off-chip, on-interposer, on-chip voltage regulators in 2.5D/3D ICs Kim, Subin; Cho, Kyungjun; Park, Shinyoung; Park, Hyunwook; Kim, Seongguk; Jeong, Seungtaek; Son, Kyungjune; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 | |
| Noise coupling analysis method for an electronic safety and arming device (ESAD) Kang, Hyungmin; Kim, Subin; Lho, Daehwan; Park, Hyunwook; Sim, Boogyo; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 | |
| Impact of On-Chip Interconnection in a Large-Scale Memristor Crossbar Array for Neural Network Accelerator and Neuromorphic Chip Shin, TaeIn; Son, Kyungjune; Kim, Seongguk; Cho, Kyungjun; Park, Shinyoung; Kim, Subin; Park, Gapyeol; Sim, Boogyo; Kim, Joungho, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 | |
| Modeling and analysis of multiple coupled through-silicon vias (TSVs) for 2.5-D/3-D ICs Cho, Kyungjun; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Kim, Seongguk; Kim, Subin; Park, Gap Yeol; Son, Kyungjune; Kim, Joungho, Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.346 - 349, Institute of Electrical and Electronics Engineers Inc., 2019-06 | |
| Electrical performance comparison between coaxial and non-coaxial silicone rubber socket Park, Junyong; Ha, Dongho; Shin, Taein; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Cho, Kyungjun; Kim, Hyesoo; Kim, Joungho; Bae, Michael, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.293 - 296, Institute of Electrical and Electronics Engineers Inc., 2019-06 | |
| Statistical Analysis of Simultaneous Switching Output (SSO) Impacts on Steady State Output Responses and Signal Integrity Kim, Youngwoo; Fujimoto, Daisuke; Nishiyama, Hikaru; Hayashi, Yu-Ichi; Lho, Daehwan; Park, Hyunwook; Kim, Joungho, 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019, pp.138 - 140, Institute of Electrical and Electronics Engineers Inc., 2019-10 |
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