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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Design and analysis of high bandwidth memory (HBM) interposer Considering Signal and Power integirty (SI/PI) for terabyte/s bandwidth system Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Kim, Heegon; Kim, Youngwoo; Choi, Sumin; Kim, Subin; Kim, Hyungsoo, DesignCon 2017, DesignCon 2017, 2017-02-01 | |
| Design of a Mobile AP GPU PDN based on Chip Power Model and Measurement Kim, Youngwoo; Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Kang, Kibum; Yang, Taisik; Paik, Woohyun, DesignCon 2016, DesignCon 2016, 2016-01-19 | |
| Eye-Diagram Estimation Methods for Voltage-and Probability-Dependent PAM4 Signal on Stacked Through-Silicon Vias (TSVs) Park, Junyong; Kim, Jonghoon J.; Choi, Sumin; Kim, Youngwoo; Kim, Joungho; Kim, Heegon, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.1724 - 1731, Electronic Components and Technology Conference 2017, 2017-05-30 | |
| Power Distribution Network (PDN) Design and Analysis of A Single and. Double-Sided High Bandwidth Memory (HBM) Interposer for 2.5D Terabtye/s Bandwidth System Cho, Kyungjun; Kim, Joungho; Kim, Youngwoo; Kim, Subin; Lee, Hyunsuk; Choi, Sumin; Kim, Heegon, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 | |
| Design and Analysis of Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module Kim, Joungho; Cho, Kyungjun; Kim, Youngwoo; Lee, Hyungsuk; Kim, Heegon; Cho, Sumin; Kim, Subin, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-06-01 | |
| Design of an On-interposer Passive Equalizer for High Bandwidth Memory (HBM) with 30Gbps Data Transmission Jeon, Yeseul; Kim, Joungho; Kim, Heegon; Choi, Sumin; Kim, Youngwoo, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 | |
| Mobile AP GPU Power Distribution Network Simulation and Analysis based on Chip Power Model Kim, Youngwoo; Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Kang, Kibum; Yang, Taisik; Paik, Woohyun, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 | |
| Electrical characteristics analysis and comparison between through silicon via(TSV) and through glass via(TGV) Kim, Jihye; Hwang, Insu; Kim, Youngwoo; Kim, Heegon; Kim, Joungho; Sundaram, Venky; Tummala, Rao, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.93 - 96, Institute of Electrical and Electronics Engineers Inc., 2015-12 | |
| Design of an on-interposer passive equalizer embedded on a ground plane for 30Gbps serial data transmission Jeon, Yeseul; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Youngwoo; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.50 - 53, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
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