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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; Jeong, Seungtaek; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 | |
| Design, Simulation and Measurement of Flexible PCB Coils for Wearable Device Wireless Power Transfer Jeong, Seungtaek; Song, Jinwook; Lee, Seongsoo; Hong, Seokwoo; Sim, Boogyo; Kim, Hongseok; Kim, Subin; Kim, Joungho, IEEE MTT-S Wireless Power Transfer Conference (WPTC 2018), IEEE MTT-S Wireless Power Transfer Conference (WPTC 2018), 2018-06-05 | |
| Measurement, Simulation and Mathematical Estimation of Magnetic Field Shielding Effectiveness of Sputtered Shielding Materials using Spiral Coils Song, Kyunghwan; Kim, Subin; Jeong, Seungtaek; Kim, Dong-Hyun; Son, Kyungjune; Heo, Jin; Han, Kyumin; Jung, Yusup; Kim, Hongseok; Kim, Joungho, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, pp.47 - 51, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, 2018-08-01 | |
| Measurement and Comparative Analysis of Shielding Effectiveness of Different Sputtered Materials Kim, Joungho; Song, Kyunghwan; Cho, Yeonje; Kim, Subin; Jeong, Seungtaek, IEEE International Symposium on Electromagnetic Compatibility, IEEE International Symposium on Electromagnetic Compatibility, 2017-08-09 | |
| Modeling, simulation and measurement of on-chip interconnects with extremely thin Si substrate for flexible electronics Jeong, Seungtaek; Lee, Seongsoo; Sim, Boogyo; Hong, Seokwoo; Park, Hyunwook; Kim, Subin; Kim, Joungho; Lee, Jaehak; Song, Junyeop, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 | |
| Power integrity comparison of off-chip, on-interposer, on-chip voltage regulators in 2.5D/3D ICs Kim, Subin; Cho, Kyungjun; Park, Shinyoung; Park, Hyunwook; Kim, Seongguk; Jeong, Seungtaek; Son, Kyungjune; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
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