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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Park, Junyong; Kim, Heegon; Bae, Bumhee; Jung, Daniel H; Ha, Dongho; Bae, Michael, DesignCon 2016, DesignCon 2016, 2016-01-19 | |
| Design of Contactless Wafer-level TSV Connectivity Testing Structure using Capacitive Coupling Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Kim, Sukjin; Bae, Bumhee; Jung, Daniel H; Kong, Sunkyu; Lee, Junho; Park, Kunwoo, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.158 - 162, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 | |
| Frequency and Time Domain Measurement of Through-Silicon Via (TSV) Failure Jung, Daniel H; Kim, Joohee; Kim, Heegon; Kim, Jonghoon J; Kim, Joungho; Pak, Jun So, Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23 | |
| Design and Measurement of a Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Differential Signaling Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Jung, Daniel H; Kim, Jonghoon J; Choi, Sumin; Lee, Junho; Park, Kunwoo, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.5 - 9, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 | |
| A Fast Statistical Eye-diagram Estimation Method including Internal PDN Noise of Pseudo-differential Receiver Buffer Kim, Joungho; Kim, Heegon; Choi, Sumin; Kim, Jonghoon J; Jung, Daniel H; Lee, Hyunuk; Cho, Kyungjun, IEEE Electrical Design of Advanced Packaging & System Symposium, IEEE Electrical Design of Advanced Packaging & System Symposium, 2015-12-15 | |
| Modeling and Analysis of Defects in Through Silicon Via Channel for Non-invasive Fault Isolation Kim, Joungho; Kim, Heegon; Kim, Jonghoon J; Kim, Sukjin; Bae, Hyun-Cheol; Choi, Kwang-Seong, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 | |
| Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel Kim, Joungho; Jung, Daniel H; Kim, Heegon; Kim, Jonghoon J; Bae, Hyun-Cheol; Choi, Kwangseong, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 | |
| Eye-diagram Estimation and Analysis of High-Bandwidth Memory (HBM) Interposer Channel with Crosstalk Reduction Schemes on 2.5D and 3D IC Choi, Sumin; Kim, Joungho; Kim, Heegon; Kim, Jonghoon J; Lim, Jaemin; Lee, Hyunsuk; Cho, Kyungjun, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 | |
| Eye Diagram Estimation of 8B/10B Encoded Highspeed Serial Link for Signal Integrity Test using Silicone Rubber Socket Park, Junyong; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Bae, Michael; Ha, Dongho, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 |
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