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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Crosstalk Reduction Passive Equalizer using MIM Capacitor between Differential Signaling Pairs on High-speed Interposer Kim, Joungho; Choi, Sumin; Kim, Heegon; Kim, Sukjin; Kim, Kiyeong; Lee, Junho; Park, Kunwoo, 2013 Asia Pacific – Radio Science Conference, 2013 Asia Pacific – Radio Science Conference, 2013-09-06 | |
| Design of Contactless Wafer-level TSV Connectivity Testing Structure using Capacitive Coupling Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Kim, Sukjin; Bae, Bumhee; Jung, Daniel H; Kong, Sunkyu; Lee, Junho; Park, Kunwoo, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.158 - 162, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 | |
| Design and Measurement of a Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Differential Signaling Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Jung, Daniel H; Kim, Jonghoon J; Choi, Sumin; Lee, Junho; Park, Kunwoo, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.5 - 9, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 | |
| Design of Crosstalk Compensation Passive Equalizers for High-speed Differential Signaling on 2.5D-IC Interposer Kim, Joungho; Choi, Sumin; Kim, Heegon; Kim, Sukjin; Jung, Daniel H; Lee, Junho; Park, Kunwoo, 2013 IEEE Electrical Design of Advanced Package & Systems Symposium , pp.253 - 256, 2013 IEEE Electrical Design of Advanced Package & Systems Symposium, 2013-12-13 | |
| Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel Kim, Joungho; Jung, Daniel H; Kim, Heegon; Kim, Jonghoon J; Bae, Hyun-Cheol; Choi, Kwangseong, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
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