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Results 21-30 of 31 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Modeling and verification of 3-dimensional resistive storage class memory with high speed circuits for core operation Son, Kyungjune; Cho, Kyungjun; Kim, Subin; Park, Shinyoung; Park, Gap Yeol; Kim, Seongguk; Shin, Taein; Kim, Joungho, 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019, pp.694 - 696, Institute of Electrical and Electronics Engineers Inc., 2019-12 | |
| Power/ground noise coupling comparison and analysis in silicon, organic and glass interposers Kim, Youngwoo; Cho, Kyungjun; Kim, Subin; Park, Gapyeol; Kim, Joungho, 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.11 - 13, Institute of Electrical and Electronics Engineers Inc., 2016-12 | |
| Power integrity comparison of off-chip, on-interposer, on-chip voltage regulators in 2.5D/3D ICs Kim, Subin; Cho, Kyungjun; Park, Shinyoung; Park, Hyunwook; Kim, Seongguk; Jeong, Seungtaek; Son, Kyungjune; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 | |
| Impact of On-Chip Interconnection in a Large-Scale Memristor Crossbar Array for Neural Network Accelerator and Neuromorphic Chip Shin, TaeIn; Son, Kyungjune; Kim, Seongguk; Cho, Kyungjun; Park, Shinyoung; Kim, Subin; Park, Gapyeol; Sim, Boogyo; Kim, Joungho, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 | |
| Modeling and analysis of multiple coupled through-silicon vias (TSVs) for 2.5-D/3-D ICs Cho, Kyungjun; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Kim, Seongguk; Kim, Subin; Park, Gap Yeol; Son, Kyungjune; Kim, Joungho, Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.346 - 349, Institute of Electrical and Electronics Engineers Inc., 2019-06 | |
| Design and Analysis of Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module Kim, Joungho; Cho, Kyungjun; Kim, Youngwoo; Lee, Hyungsuk; Kim, Heegon; Cho, Sumin; Kim, Subin, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-06-01 | |
| Electrical performance comparison between coaxial and non-coaxial silicone rubber socket Park, Junyong; Ha, Dongho; Shin, Taein; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Cho, Kyungjun; Kim, Hyesoo; Kim, Joungho; Bae, Michael, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.293 - 296, Institute of Electrical and Electronics Engineers Inc., 2019-06 | |
| Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Kim, Joungho, IEEE International 3D Systems Integration Conference, 3DIC 2016, Institute of Electrical and Electronics Engineers Inc., 2017-11 | |
| Eye-diagram Estimation and Analysis of High-Bandwidth Memory (HBM) Interposer Channel with Crosstalk Reduction Schemes on 2.5D and 3D IC Choi, Sumin; Kim, Joungho; Kim, Heegon; Kim, Jonghoon J; Lim, Jaemin; Lee, Hyunsuk; Cho, Kyungjun, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 | |
| Eye-diagram estimation using equivalent circuit model of coupled microstrip channel on high-speed and wide I/O Channel for 2.5D and 3D IC Choi, Sumin; Kim, Joungho; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Lim, Jaemin; Lee, Hyunsuk; Cho, Kyungjun, 20th IEEE Workshop on Signal and Power Integrity, SPI 2016, Institute of Electrical and Electronics Engineers Inc., 2016-05-08 |