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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Electrical Performance Analysis of Low-Cost and Ultra-Thin Glass Interposer: Advantages, Challenges and Solutions Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Park, Shinyoung; Ahn, Seungyoung, DesignCon 2018, DesignCon 2018, 2018-01-31 | |
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; Jeong, Seungtaek; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 | |
| Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Son, Kyungjune; Park, Hyunwook; Kim, Joungho; Watanabee, Atom; Raj, Pulugurtha Markondeya; Sundaram, Venky; Tummala, Rao, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.107 - 109, IEEE, 2018-10-15 | |
| Electrical Performance Analysis of Glass Interposer Channel and Power Distribution Network Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Jeong, Seungtaek; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.3 - 5, IEEE, 2018-10-15 | |
| Reinforcement Learning-based Optimal On-board Decoupling Capacitor Design Method Park, Hyunwook; Park, Junyong; Kim, Subin; Lho, Daehwan; Park, Shinyoung; Park, Gapyeol; Cho, Kyungjun; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.213 - 215, IEEE, 2018-10-15 | |
| Estimation and Analysis of Crosstalk Effects in High-Bandwidth Memory Channel Choi, Sumin; Kim, Heegon; Park, Junyong; Kim, Dong-Hyun; Jung, Daniel H; Lim, Jaemin; Cho, Kyungjun; Kim, Joungho, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), pp.4 - 4, IEEE EMC & APEMC, 2018-05-16 | |
| Bias-dependent Power Distribution Network Impedance Analysis with MOS Capacitor Kim, Dong-Hyun; Kim, Subin; Park, Junyong; Kim, Youngwoo; Choi, Sumin; Cho, Kyungjun; Kim, Joungho, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), pp.40 - 40, IEEE EMC & APEMC, 2018-05-16 | |
| Modeling and Signal Integrity Analysis of 3D XPoint Memory Cells and Interconnections with Memory Size Variations During Read Operation Son, Kyungjune; Cho, Kyungjun; Kim, Subin; Park, Gapyeol; Song, Kyunghwan; Kim, Joungho, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, pp.223 - 227, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, 2018-08-01 |
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