Search
Results 1-3 of 3 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Signal Integrity Design of Bump-less Interconnection for High-speed Signaling in 2.5D and 3D IC Kim, Joungho; Kim, Heegon; Choi, Sumin; Kim, Dong-Hyun; Cho, Kyungjun, 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2015-05-26 | |
| Electrical Performance of High Bandwidth Memory (HBM) Interposer Channel in Terabyte/s Bandwidth Graphics Module Kim, Joungho; Cho, Kyungjun; Kim, Heegon; Choi, Sumin; Lim, Jaemin, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 | |
| A Fast Statistical Eye-diagram Estimation Method including Internal PDN Noise of Pseudo-differential Receiver Buffer Kim, Joungho; Kim, Heegon; Choi, Sumin; Kim, Jonghoon J; Jung, Daniel H; Lee, Hyunuk; Cho, Kyungjun, IEEE Electrical Design of Advanced Packaging & System Symposium, IEEE Electrical Design of Advanced Packaging & System Symposium, 2015-12-15 |
Discover