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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Modeling of Through-silicon Via (TSV) with an hmbedded High-density Metal-insulator-metal (MIM) Capacitor Cho, Kyunjun; Kim, Youngwoo; Kim, Subin; Park, Gapyeol; Son, Kyungjune; Park, Hyunwook; Kim, Seongguk; Choi, Sumin; Kim, Dong-Hyun; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 | |
| Measurement, Simulation and Mathematical Estimation of Magnetic Field Shielding Effectiveness of Sputtered Shielding Materials using Spiral Coils Song, Kyunghwan; Kim, Subin; Jeong, Seungtaek; Kim, Dong-Hyun; Son, Kyungjune; Heo, Jin; Han, Kyumin; Jung, Yusup; Kim, Hongseok; Kim, Joungho, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, pp.47 - 51, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, 2018-08-01 | |
| Modeling and Signal Integrity Analysis of 3D XPoint Memory Cells and Interconnections with Memory Size Variations During Read Operation Son, Kyungjune; Cho, Kyungjun; Kim, Subin; Park, Gapyeol; Song, Kyunghwan; Kim, Joungho, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, pp.223 - 227, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, 2018-08-01 |
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