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Results 51-56 of 56 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Power integrity comparison of off-chip, on-interposer, on-chip voltage regulators in 2.5D/3D ICs Kim, Subin; Cho, Kyungjun; Park, Shinyoung; Park, Hyunwook; Kim, Seongguk; Jeong, Seungtaek; Son, Kyungjune; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 | |
| Noise coupling analysis method for an electronic safety and arming device (ESAD) Kang, Hyungmin; Kim, Subin; Lho, Daehwan; Park, Hyunwook; Sim, Boogyo; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 | |
| Electrical performance comparison between coaxial and non-coaxial silicone rubber socket Park, Junyong; Ha, Dongho; Shin, Taein; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Cho, Kyungjun; Kim, Hyesoo; Kim, Joungho; Bae, Michael, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.293 - 296, Institute of Electrical and Electronics Engineers Inc., 2019-06 | |
| Statistical Analysis of Simultaneous Switching Output (SSO) Impacts on Steady State Output Responses and Signal Integrity Kim, Youngwoo; Fujimoto, Daisuke; Nishiyama, Hikaru; Hayashi, Yu-Ichi; Lho, Daehwan; Park, Hyunwook; Kim, Joungho, 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019, pp.138 - 140, Institute of Electrical and Electronics Engineers Inc., 2019-10 | |
| Design and Analysis of On-package Inductor of an Integrated Voltage Regulator for High-Q Factor and EMI Shielding in Active Interposer based 2.5D/3D ICs Kim, Subin; Jeong, Seungtaek; Sim, Boogyo; Lee, Seongsoo; Park, Hyunwook; Kim, Haeyeon; Kim, Joungho, 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, pp.498 - 503, IEEE, 2021-07-26 | |
| Deterministic Policy Gradient-based Reinforcement Learning for DDR5 Memory Signaling Architecture Optimization considering Signal Integrity Lho, Daehwan; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Sim, Boogyo; Son, Kyungjune; Son, Keeyoung; Kim, Jihun; Choi, Seonguk; Park, Joonsang; Kim, Haeyeon; Kong, Kyubong; Kim, Joungho, 31st IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-10 |