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Results 31-40 of 56 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Deep Reinforcement Learning-based Channel-flexible Equalization Scheme: An Application to High Bandwidth Memory Choi, Seonguk; Kim, Joungho; Park, Hyunwook; Kim, Haeyeon; Park, Joonsang; Son, Keeyoung; Kim, SeongGuk; Kim, Keunwoo; Lho, Daehwan; Yoon, Jiwon; Song, Jinwook, DesignCon 2022, DesignCon, 2022-04-07 | |
| Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box Son, Kyungjune; Choi, Sumin; Jung, Daniel Hyunsuk; Kim, Keunwoo; Park, Gapyeol; Lho, Daehwan; Park, Hyunwook; Park, Shinyoung; Kim, Joungho; Cho, Youngje; Park, Byungsoo; Choi, Seongmin, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 | |
| Design and analysis of flexible interconnects on an extremely thin silicon substate for flexible wearable devices Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Park, Shinyoung; Park, Hyunwook; Kim, Joungho; Lee, Jae Hak; Song, Jun Yeob, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.387 - 390, Institute of Electrical and Electronics Engineers Inc., 2019-06 | |
| Deep Reinforcement Learning-based Interconnection Design for 3D X-Point Array Structure Considering Signal Integrity Son, Kyungjune; Kim, Minsu; Park, Hyunwook; Park, Shinyoung; Park, Gap Yeol; Lho, Daewhan; Kim, Seoungguk; Shin, Taein; Son, Keeyoung; Kim, Keunwoo; Kim, Joungho, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 | |
| Deep Neural Network-based Lumped Circuit Modeling using Impedance Curve Lho, Daehwan; Park, Hyunwook; Kim, Seongguk; Shin, Taein; Kim, Keunwoo; Son, Kyungjune; Kang, Hyungmin; Sim, Boogyo; Son, Keeyoung; Kim, Minsu; Kim, Joungho, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 | |
| Policy Gradient Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for 2.5-D/3-D ICs using Transformer Network Park, Hyunwook; Kim, Minsu; Kim, Subin; Jeong, Seungtaek; Kim, Seongguk; Kang, Hyungmin; Kim, Keunwoo; Son, Keeyoung; Park, Gapyeol; Son, Kyungjune; Shin, Taein; Kim, Joungho, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 | |
| Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module Kim, Hyunwoo; Park, Joonsang; Son, Keeyoung; Kim, Joungho; Kim, Haeyeon; Park, Hyunwook; Shin, TaeIn; Kim, Keunwoo; Yoon, Jiwon; Lee, Junghyun; Hong, Jonghyun; Kim, Juneyoung, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 | |
| Signal Integrity and Power Leakage Optimization for 3D X-Point Memory Operation using Reinforcement Learning Son, Kyungjune; Kim, Joungho; Kim, Keunwoo; Park, Gap Yeol; Lho, Daehwan; Park, Hyunwook; Sim, BooGyo; Shin, TaeIn; Park, Joonsang; Kim, Haeyeon, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-11 | |
| Scalable Transformer Network-based Reinforcement Learning Method for PSIJ Optimization in HBM Park, Hyunwook; Kim, Joungho; Shin, TaeIn; Kim, SeongGuk; Lho, Daehwan; Sim, BooGyo; Song, Jinwook; Kong, Kyubong, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-10 | |
| Intra-pair Skew Impact Analysis of High-speed Cables for HDMI Interface Sim, BooGyo; Kim, Joungho; Kim, Keunwoo; Shin, TaeIn; Park, Hyunwook; Kim, SeongGuk; Lho, Daehwan; Son, Keeyoung; Jeong, Seung Taek, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-10 |