Search
Results 1-10 of 18 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Modeling of Through-silicon Via (TSV) with an hmbedded High-density Metal-insulator-metal (MIM) Capacitor Cho, Kyunjun; Kim, Youngwoo; Kim, Subin; Park, Gapyeol; Son, Kyungjune; Park, Hyunwook; Kim, Seongguk; Choi, Sumin; Kim, Dong-Hyun; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 | |
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; Jeong, Seungtaek; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 | |
| Reinforcement Learning-based Optimal On-board Decoupling Capacitor Design Method Park, Hyunwook; Park, Junyong; Kim, Subin; Lho, Daehwan; Park, Shinyoung; Park, Gapyeol; Cho, Kyungjun; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.213 - 215, IEEE, 2018-10-15 | |
| A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM) Son, Keeyoung; Kim, Subin; Park, Hyunwook; Kim, Seongguk; Kim, Keunwoo; Park, Shinyoung; Sim, Boogyo; Jeong, Seungtaek; Park, Gapyeol; Kim, Joungho, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 | |
| Design, simulation and measurement of a flexible voltage-controlled oscillator (VCO) chip with bending radius Jeong, Seungtaek; Lee, Seongsoo; Hong, Seokwoo; Sim, Boogyo; Park, Hyunwook; Kim, Subin; Kim, Youngwoo; Son, Keeyeong; Kim, Joungho, IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), IEEE, 2020-10 | |
| Convolutional Neural Network-based Fast and Accurate Irregular Shape Power/Ground Plane Impedance Estimation Method for High-Speed Signaling Kim, Keunwoo; Lho, Daehwan; Park, Hyunwook; Son, Keeyoung; Kim, Seongguk; Park, Shinyoung; Sim, Boogyo; Kim, Subin; Kim, Joungho, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 | |
| Reinforcement Learning-based Auto-router considering Signal Integrity Kim, Minsu; Park, Hyunwook; Kim, Seongguk; Son, Keeyoung; Kim, Subin; Son, Kyunjune; Choi, Seonguk; Park, Gapyeol; Kim, Joungho, 29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020, IEEE, 2020-10 | |
| A New Design Method of GDDR6 WCLK Using Reinforcement Learning for over 20Gbps Park, Hyunwook; Kim, Joungho; Cho, Kyungjun; Sim, BooGyo; Kim, Subin; Jeong, Seung Taek, DesignCon 2021, IEEE, 2021-08-16 | |
| Wireless Memory Test: A Breakthrough Solution for Highly Reliable HBM Park, Hyunwook; Kim, Joungho; Kim, Subin; Kim, SeongGuk; Jeong, Seung Taek; Park, Gap Yeol, Designcon 2021, IEEE, 2021-08-17 | |
| Design and analysis of flexible interconnects on an extremely thin silicon substate for flexible wearable devices Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Park, Shinyoung; Park, Hyunwook; Kim, Joungho; Lee, Jae Hak; Song, Jun Yeob, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.387 - 390, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
Discover
Type
- 18 Conference