Showing results 1 to 5 of 5
4 W Dual-Contact Material MEMS Relay with a Contact Force Maximizing Structure Kim, Su-Bon; Yoon, Yong Hoon; Lee, Yong-Bok; Choi, Kwang-Wook; Jo, Min-Seung; Min, Hyun-Woo; Yoon, Jun-Bo, 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020, pp.114 - 117, Institute of Electrical and Electronics Engineers Inc., 2020-01-21 |
Carbon nanotubes network contact lubrication for highly reliable MEMS switch Seo, Min-Ho; Jo, Eunhwan; Ko, Seung-Deok; Choi, Jungwook; Yoon, Yong Hoon; Kwon, Dae-Sung; Kim, Jongbaeg; et al, 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017, pp.5 - 8, Institute of Electrical and Electronics Engineers Inc., 2017-01-23 |
Highly reliable MEMS relay with two-step spring system and heat sink insulator for power applications Yoon, Yong Hoon; Song, Yong Ha; Ko, Seung Deok; Han, Chang Hoon; Youn, Gun Sik; Seo, Min Ho; Yoon, Jun Bo, The 28th IEEE International Conference on Micro electro Mechanical System, MEMS 2015, pp.114 - 117, IEEE, 2015-01-21 |
Inductance enhancement of a MEMS inductor with self-aligned magnetic nanoparticles Lee, Jae Shin; Ko, Seung-Deok; Han, Chang-Hoon; Yoon, Yong Hoon; Seo, Min-Ho; Yoon, Jun-Bo, 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017, pp.893 - 896, Institute of Electrical and Electronics Engineers Inc., 2017-01-23 |
MEMS packaging method without any heating or external force using adhesive bonding assisted by capillary force Han, Chang-Hoon; Kim, Chang-Keun; Yoon, Yong Hoon; Seo, Min-Ho; Ko, Seung-Deok; Yoon, Jun-Bo, 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017, pp.1221 - 1224, Institute of Electrical and Electronics Engineers Inc., 2017-06 |
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