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Showing results 1 to 7 of 7

1
Effect of Reduced Graphene Oxide Cap Layer on Electromigration Reliability of Cu Interconnect

Yoon, Seong Jun; Choi, Sung-Yool; Cho, Byung-Jin, Graphene 2014, Graphene 2014, 2014-05-06

2
Graphene as an Ultrathin Diffusion Barrier for Advanced Cu Metallization

Bong, Jae Hoon; Yoon, Seong Jun; Yoon, Alexander; Hwang, Wan Sik; Cho, Byung-Jin, Graphene Week 2015, Graphene Week 2015, 2015-06-24

3
Improved Electromigration-Resistance of Cu Interconnects by Graphene-Based Capping Layer

Yoon, Seong Jun; Yoon, Alexander; Hwang, Wan Sik; Choi, Sung-Yool; Cho, Byung-Jin, 2015 Symposium on VLSI Technology, 2015 Symposium on VLSI Technology, 2015-06-15

4
Process Integration for Graphene-based RF FET

Cho, Byung Jin; Mun, Jeong Hun; Hong, Seul Ki; Song, Seung Min; Oh, Joong Gun; Bong, Jae Hoon; Yoon, Seong Jun, The 6th International Conference on Recent Progress in Graphene Research (RPGR) 2014, National Taiwan University, 2014-09-24

5
Process Integration for Graphene-Based RF Transistors

Cho, Byung-Jin; Mun, Jeong Hun; Hong, Seul Ki; Song, Seung Min; Oh, Joong Gun; Bong, Jae Hoon; Yoon, Seong Jun, AsiaNANO 2014, Korea Printed Electronics Association, 2014-10-28

6
PVP/GO:Graphene/polymer composite film as a Cu diffusion barrier

Kim, Jae Hwan; Yoon, Seong Jun; Bong, Jae Hoon; Yoon, Alexander; Cho, Byung Jin, The 8th International Conference on Recent Progress in Graphene/2D Research, SKKU Advanced Institute of Nano Technology, 2016-09-27

7
Selective Pore-Sealing of Highly Porous Ultralow-k dielectrics for ULSI Interconnects by Cyclic Initiated Chemical Vapor Deposition Process

Yoon, Seong Jun; Pak, Kwanyong; Ahn, Hyun Jun; Yoon, Alexander; Im, Sung Gap; Cho, Byung Jin, 38th IEEE Symposium on VLSI Technology, pp.73 - 74, IEEE, 2018-06

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