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1
Analysis and Optimization of a Power Distribution Network in 2.5D IC with Glass Interposer

Kim, Joungho; Jonghyun Cho; Kiyeong Kim; Heegon Kim; Srikrishna Sitaraman; Venky Sundaram; Rao Tummala, IEEE International 3D Systems Integration Conference, IEEE International 3D Systems Integration Conference, 2014-12-01

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