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Showing results 1 to 11 of 11

1
A deep neural network-based estimation of efficiency enhancement by an intermediate coil in automotive wireless power transfer system

Sim, Boogyo; Lho, Daehwan; Park, Dongryul; Lee, Seongsoo; Jeong, Seung Taek; Kim, Hongseok; Park, Hyunwook; et al, 2020 IEEE Wireless Power Transfer Conference, WPTC 2020, pp.231 - 233, Institute of Electrical and Electronics Engineers Inc., 2020-11

2
A Deep Neural Network-based Estimation of EMI Reduction by an Intermediate Coil in Automotive Wireless Power Transfer System

Sim, Boogyo; Lho, Daehwan; Park, Dongryul; Park, Hyunwook; Kang, Hyungmin; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.407 - 410, Institute of Electrical and Electronics Engineers Inc., 2020-07

3
An Induction Heating System Analysis Method based on Operating Conditions

Kang, Hyungmin; Lho, Daehwan; Park, Hyunwook; Kong, Taewoong; Choi, Hyojin; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.478 - 481, Institute of Electrical and Electronics Engineers Inc., 2020-07

4
Bayesian Optimization of High-Speed Channel for Signal Integrity Analysis

Lho, Daehwan; Park, Junyong; Park, Hyunwook; Park, Shinyoung; Kim, SeongGuk; Kang, Hyungmin; Kim, Subin; et al, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10

5
Deep Neural Network-based Lumped Circuit Modeling using Impedance Curve

Lho, Daehwan; Park, Hyunwook; Kim, Seongguk; Shin, Taein; Kim, Keunwoo; Son, Kyungjune; Kang, Hyungmin; et al, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12

6
Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs

Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Park, Gap Yeol; Park, Joonsang; Son, Kyungjune; Sim, BooGyo; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17

7
Eye-width and Eye-height Estimation Method based on Artificial Neural Network (ANN) for USB 3.0

Lho, Daehwan; Park, Junyong; Park, Hyunwook; Kang, Hyungmin; Park, Shinyoung; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.209 - 211, IEEE, 2018-10-15

8
Modeling and Verification of a High Voltage Fuse for High Reliability and Safety in Electric Vehicle

Kim, Subin; Shin, Taein; Jeong, Seungtaek; Kang, Hyungmin; Son, Keeyoung; Park, Shinyoung; Kim, Hyunho; et al, 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.287 - 292, Institute of Electrical and Electronics Engineers Inc., 2020-07

9
Noise coupling analysis method for an electronic safety and arming device (ESAD)

Kang, Hyungmin; Kim, Subin; Lho, Daehwan; Park, Hyunwook; Sim, Boogyo; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12

10
Policy Gradient Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for 2.5-D/3-D ICs using Transformer Network

Park, Hyunwook; Kim, Minsu; Kim, Subin; Jeong, Seungtaek; Kim, Seongguk; Kang, Hyungmin; Kim, Keunwoo; et al, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12

11
Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics

Park, Hyunwook; Kim, Joungho; Park, Joonsang; Park, Gap Yeol; Lho, Daehwan; Sim, BooGyo; Kang, Hyungmin; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13

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