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Microwave frequency model of flip-chip interconnects using anisotropic conductive film

Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Ahn, Seung Young; Yun, Young-Hwan; Ham, Seog-Heon; et al, Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp.311 - 315, SPIE, 1999-04-06

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