Browse "EE-Conference Papers(학술회의논문)" by Author Changhyun Ch

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1
Contactless Wafer-Level TSV Connectivity Testing Method Using Magnetic Coupling

Kim, Joungho; Heegon Kim; Sukjin Kim; Changhyun Ch; Daniel H. Jung; Jun So Pak, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10

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