Showing results 1 to 9 of 9
10Gbps backplane design methodology with sensitivity analysis and statistical analysis Kim, J.; Baek, S.; Park, H.; Kim, S.; Hong, Y.; Lim, D.; Kim, Joungho, 7th Electronics Packaging Technology Conference, EPTC 2005, pp.38 - 42, IEEE, 2005-12-07 |
A dual-slope signaling scheme to suppress electromagnetic interference (EMI) with sustaining eye margin Yoon, C.; Baek, S.; Lee, H.; Jeong, Y.; Park, J.; Park, H.; Sung, B.; et al, 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008, pp.143 - 146, 2008-10-27 |
Accurate high frequency lossy model of differential signal line including mode-conversion and common-mode propagation effect Baek, S.; Ahn, S.; Park, J.; Kim, Joungho; Kim, J.; Cho, J.-H., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.562 - 566, IEEE, 2004-08-09 |
Compensation of BSD and device input capacitance by using embedded inductor on PCB substrate for 3 Gbps SerDes applications Ahn, S.; Baek, S.; Lee, J.; Kim, Joungho, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.2, pp.499 - 504, 2004-08-09 |
Diagnosis of dental cavity and osteoporosis using terahertz transmission images Ryu, J.; Jung, Y.; Baek, S.; Lee, J.; Kim, S.; Kwon, S.; Kim, Joungho, International Conference on Ultrafast Phenomena (UP), pp.265 - 267, International Conference on Ultrafast Phenomena (UP), 2000-07-09 |
Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB Kam, D.G.; Lee, H.; Baek, S.; Park, B.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, 2002, pp.643 - 647, IEEE, 2002-08-19 |
GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises Kam, D.G.; Lee, H.; Baek, S.; Park, B.; Kim, Joungho, 52nd Electronic Components and Technology Conference, pp.1058 - 1065, 2002-05-28 |
Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board Baek, S.; Kam, D.G.; Par,k B.; Kim, Joungho; Byun, J.-G.; Choi, C.-S., 2002 IEEE International Symposium on Electromagnetic Compatibility, pp.200 - 204, IEEE, 2002-08-19 |
Noise coupling to signal trace and via from power/ground simultaneous switching noise in high speed double data rates memory module Park, J.; Kim, H.; Pak, J.S.; Jeong, Y.; Baek, S.; Kim, Joungho; Lee, J.-J.; et al, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.592 - 597, IEEE, 2004-08-09 |
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