Browse "EE-Conference Papers(학술회의논문)" by Author Bae, Michael

Showing results 1 to 8 of 8

1
Analysis of external force dependent lumped RLGC model of high-bandwidth and high-density silicone rubber socket

Park, Junyong; Kim, Hyesoo; Kim, Youngwoo; Kim, Jonghoon J; Bae, Bumhee; Kim, Joungho; Ha, Dongho; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.54 - 57, Institute of Electrical and Electronics Engineers Inc., 2015-12

2
Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test

Kim, Jonghoon J; Kim, Joungho; Park, Junyong; Kim, Heegon; Bae, Bumhee; Jung, Daniel H; Ha, Dongho; et al, DesignCon 2016, DesignCon 2016, 2016-01-19

3
Electrical performance comparison between coaxial and non-coaxial silicone rubber socket

Park, Junyong; Ha, Dongho; Shin, Taein; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Cho, Kyungjun; et al, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.293 - 296, Institute of Electrical and Electronics Engineers Inc., 2019-06

4
Eye Diagram Estimation of 8B/10B Encoded Highspeed Serial Link for Signal Integrity Test using Silicone Rubber Socket

Park, Junyong; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Bae, Michael; Ha, Dongho, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27

5
High-frequency modeling and signal integrity analysis of high-density silicone rubber socket

Kim, Hyesoo; Park, Junyong; Park, Shinyoung; Kim, Jonghoon J; Kim, Joungho; Ha, Dongho; Bae, Michael; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.55 - 57, Institute of Electrical and Electronics Engineers Inc., 2016-12

6
Measurement of High-bandwidth and High-density Silicone Rubber Socket up to 110GHz

Park, Junyong; Kim, Joungho; Kim, Hyesoo; Kim, Jonghoon J; Bae, Bumhee; Ha, Dongho; Bae, Michael, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31

7
Modeling and analysis of a conductive rubber contactor for package test

Kim, Hyesoo; Bae, Bumhee; Kim, Jonghoon J; Park, Junyong; Ha, Dongho; Bae, Michael; Kim, Joungho, 17th IEEE Electronics Packaging and Technology Conference, EPTC 2015, Institute of Electrical and Electronics Engineers Inc., 2015-12

8
Modeling and Measurement of High-bandwidth and High-density Silicone Rubber Socket for 100Gbps Transceiver IC Test

Park, Jun Yong; Kim, Hye Soo; Won, Hyo Sup; Kim, Jong Hoon; Bae, Bum Hee; Ha, Dong Ho; Bae, Michael; et al, 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015-10-25

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