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Showing results 1 to 4 of 4

1
Modeling and Analysis of Defects in Through Silicon Via Channel for Non-invasive Fault Isolation

Kim, Joungho; Kim, Heegon; Kim, Jonghoon J; Kim, Sukjin; Bae, Hyun-Cheol; Choi, Kwang-Seong, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31

2
Modeling and Analysis of High-Speed Through Silicon Via (TSV) Channel and Defects

Jung, Daniel H; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Bae, Hyun-Cheol; et al, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.430 - 433, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27

3
Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel

Kim, Joungho; Jung, Daniel H; Kim, Heegon; Kim, Jonghoon J; Bae, Hyun-Cheol; Choi, Kwangseong, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15

4
Modeling, Measurement, and Analysis of TSV Channel and Defects for 2.5D/3D IC Failure Analysis

Kim, Joungho; Jung, Daniel H; Bae, Hyun-Cheol; Choi, Kwang-Seong; Youn, Joong Suk, DesignCon 2017, DesignCon 2017, 2017-02-01

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