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Showing results 25 to 30 of 30

25
Temperature-Dependent Through-Silicon Via (TSV) Model and Noise Coupling

Lee, Manho; Cho,Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24

26
Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity

Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29

27
Through-Silicon Via (TSV) Depletion Effect

Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24

28
TSV-based Decoupling Capacitor Schemes in 3D-IC

Song, Eunseok; Pak, Jun So; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29

29
Vertical Tree 3-dimensional TSV Clock Distribution Network in 3D IC

Kim, Dayoung; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Pak, Kunwoo, Vertical Tree 3-dimensional TSV Clock Distribution Network in 3D IC, Vertical Tree 3-dimensional TSV Clock Distribution Network in 3D IC, 2012-05-29

30
Via: A Source of Simultaneous Switching Noise Generation, Coupling, and Edge Radiation in High-speed Multi-layer Digital PCB

Kim, Joungho; Park, Jongbae; Pak, Jun So; Kim, Hyungsoo, 2004 Korea-Japan Joint Conference on AP/EMC/EMT (KJJC), pp.22 - 23, 2004-11

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