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Power and Signal Integrity Analysis of Fan-out Wafer Level Package for Mobile Application Processor Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Kim, Subin; Kang, Kibum; So, Kwangsup; et al, DesignCon 2017, DesignCon 2017, 2017-01-31 |
Power distribution network design and optimization based on frequency dependent target impedance Kim, Youngwoo; Kim, Kiyeong; Cho, Jong-Hyun; Kim, Joungho; Kang, Kibum; Yang, Taisik; Ra, Yun; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.89 - 92, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
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