유전 경화 모니터링을 이용한 후판 복합재료의 스마트 성형 기법Smart cure process for thick composites using dielectric cure monitoring

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 572
  • Download : 0
DC FieldValueLanguage
dc.contributor.advisor이대길-
dc.contributor.advisorLee, Dai-Gil-
dc.contributor.author김형근-
dc.contributor.authorKim, Hyoung-Geun-
dc.date.accessioned2011-12-14T05:21:00Z-
dc.date.available2011-12-14T05:21:00Z-
dc.date.issued2003-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=231049&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/43206-
dc.description학위논문(박사) - 한국과학기술원 : 기계공학전공, 2003.8, [ x, 105 p. ]-
dc.languagekor-
dc.publisher한국과학기술원-
dc.subject복합재료-
dc.subject후판-
dc.subject경화-
dc.subject유전-
dc.subject성형-
dc.subjectprocess-
dc.subjectcomposites-
dc.subjectthick-
dc.subjectcure-
dc.subjectdielectric-
dc.title유전 경화 모니터링을 이용한 후판 복합재료의 스마트 성형 기법-
dc.title.alternativeSmart cure process for thick composites using dielectric cure monitoring-
dc.typeThesis(Ph.D)-
dc.identifier.CNRN231049/325007 -
dc.description.department한국과학기술원 : 기계공학전공, -
dc.identifier.uid020005091-
dc.contributor.localauthor이대길-
dc.contributor.localauthorLee, Dai-Gil-
Appears in Collection
ME-Theses_Ph.D.(박사논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0