반도체 패키지 내에 존재하는 균열의 거동에 관한 연구A study on behavior of crack in a plastic package
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 엄윤용 | - |
| dc.contributor.advisor | Earmme, Youn-Young | - |
| dc.contributor.author | 이혁 | - |
| dc.contributor.author | Lee, Hyouk | - |
| dc.date.accessioned | 2011-12-14T05:14:27Z | - |
| dc.date.available | 2011-12-14T05:14:27Z | - |
| dc.date.issued | 1996 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=105467&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/42797 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 기계공학과, 1996.2, [ x, 80 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 압력하중 | - |
| dc.subject | 열하중 | - |
| dc.subject | 패키지균열 | - |
| dc.subject | 균열진전방향 | - |
| dc.subject | Crack propagation direction | - |
| dc.subject | Pressure loading | - |
| dc.subject | Thermal loading | - |
| dc.subject | Package crack | - |
| dc.title | 반도체 패키지 내에 존재하는 균열의 거동에 관한 연구 | - |
| dc.title.alternative | A study on behavior of crack in a plastic package | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 105467/325007 | - |
| dc.description.department | 한국과학기술원 : 기계공학과, | - |
| dc.identifier.uid | 000885386 | - |
| dc.contributor.localauthor | 엄윤용 | - |
| dc.contributor.localauthor | Earmme, Youn-Young | - |
- Appears in Collection
- ME-Theses_Ph.D.(박사논문)
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