양극 산화된 알루미늄 기판 기반의 박막 MCM-D를 이용한 분산증폭기의 설계 및 제작Design and fabrication of distributed amplifier using thin film MCM-D based on anodized aluminum substrate

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Advisors
권영세researcherKwon, Young-Seresearcher
Description
한국과학기술원 : 전기및전자공학전공,
Publisher
한국과학기술원
Issue Date
2007
Identifier
268864/325007  / 020053280
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 전기및전자공학전공, 2007. 8, [ viii, 61 p. ]

Keywords

분산증폭기; 멀티칩모듈; 알루미늄; distributed amplifier,multichip module; MCM-D; Aluminum; 분산증폭기; 멀티칩모듈; 알루미늄; distributed amplifier,multichip module; MCM-D; Aluminum

URI
http://hdl.handle.net/10203/38518
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=268864&flag=dissertation
Appears in Collection
EE-Theses_Master(석사논문)
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