Two-step rapid thermal diffusion od phosphorus and boron into silicon from solid diffusion sources고체 확산 소오스를 사용한 인과 붕소의 실리콘으로의 2단계 고속 열 확산

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Two-step rapid thermal diffusion of phosphorus and boron into silicon using solid diffusion sources have been performed. In the first step, the glass of $HBO_2$ or $P_2O_5$ is transferred from the solid diffusion sources to the processing wafer and in the second step, the predeposition of the dopants into the processing wafer from the glass is performed. By separating the glass transfer and the predeposition in the two-step rapid thermal diffusion, extremely shallow junctions with junction depths of about 25nm as well as deep junctions with junction depths of about 530nm are achieved. By using a pyrometer to read the temperatures of a wafer in the rapid thermal diffusion system in which tungsten-halogen lamps are placed at one side of the wafer, the reproducibility of the sheet resistance is enhanced to be within ±2%. Using a patterned heating wafer during the glass transfer and using a 4 inch silicon ring during the predeposition, the uniformity of the sheet resistance of about ±10% in a 3 inch wafer except outer 5 mm rim has been achieved. In the phosphorus diffusion, the diffusion characteristics during the glass transfer process are analyzed. The electrically active doping concentration at the surface after the predeposition at 1100℃ for 2 sec is about $3\times10^{20}cm^{-3}$. By comparing the electrically active doping profile measured by ASR and the chemical doping profile measured by SIMS, it is found that most of the phosphorus atoms contribute to the electrical conduction uniformly. Diodes with a junction depth of about 150nm have been fabricated. The areal and edge leakage current densities at 5V reverse bias are 1.06 nA/㎠ and 90.2 pA/cm, respectively, The ideality factor is about 1.04. In the boron diffusion, ambient gas during the predeposition affects sheet resistances and junction depths. The predeposition at 1100℃ in $O_2$ ambient makes sheet resistances lower and junction depths deeper when compared with the predeposition in $N_2$ ambient. I...
Advisors
Kim, Choong-Ki김충기
Description
한국과학기술원 : 전기 및 전자공학과,
Publisher
한국과학기술원
Issue Date
1989
Identifier
61367/325007 / 000835088
Language
eng
Description

학위논문(박사) - 한국과학기술원 : 전기 및 전자공학과, 1989.8, [ iv, 108 p. ]

URI
http://hdl.handle.net/10203/36098
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=61367&flag=dissertation
Appears in Collection
EE-Theses_Ph.D.(박사논문)
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