Runtime power management for 3-dimensional processor systems3차원 프로세서 시스템을 위한 실시간 동적 전력 관리

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With increasing system integration as a result of device scaling (for 2D dies) and 3D integration, chip power density in microprocessors is expected to exponentially increase every years. Because power consumed by the microprocessors is converted into heat, the corresponding high power density (i.e., power dissipation per unit volume) incurs many temperature-related problems in reliability, power, performance, and manufacturing cost. In this dissertation, techniques and algorithms (e.g., DVFS, power gating, and thread scheduling) are proposed to address the temperature-related issues, especially focusing on the power and the performance. In Chapter 1, the challenges of system integration are introduced. Chapter 2 reviews the related works. Chapter 3 focuses on the energy minimization issues in single processor systems. At high operating temperature, chip cooling is crucial due to the exponential temperature dependence of leakage current. In Chapter 3, we proposed a method for delivering lower energy consumption by integrating the cooling and running in a temperature-aware manner without incurring performance penalty. In order to further reduce the energy consumption, we exploited the runtime distribution of each sub-segment of a task called ‘bin’ in an analytical manner such that time budget for cooling in each bin is allocated in proportion to the probability of the occurrence of the bin. In chapter 4, we proposed a runtime power management method for both peak power and temperature constrained 3D multi-core systems in order to maximize the instruction throughput. To do that, the proposed method exploits dynamic temperature slack (defined as peak temperature constraint minus current temperature) and workload characteristics (e.g., instructions per cycle and memory-boundness) as well as thermal characteristics of 3D stacking architectures. Conclusion are drawn in Chapter 5.
Advisors
Kyung, Chong-Minresearcher경종민researcher
Description
한국과학기술원 : 전기 및 전자공학과,
Publisher
한국과학기술원
Issue Date
2010
Identifier
455415/325007  / 020037001
Language
eng
Description

학위논문(박사) - 한국과학기술원 : 전기 및 전자공학과, 2010.08, [ ⅸ, 81 p. ]

Keywords

Runtime; Temperature management; Power management; 3D IC; Chip multiprocessor; 칩 멀티 프로세서; 실시간; 온도 관리; 전력 관리; 삼차원 집적회로

URI
http://hdl.handle.net/10203/35600
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=455415&flag=dissertation
Appears in Collection
EE-Theses_Ph.D.(박사논문)
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