학위논문(박사) - 한국과학기술원 : 전기및전자공학전공, 2008. 8., [ iv, 125 p. ]
Alumimum; Anodizing; Packaging; Chip-In; RF; 알루미늄; 양극산화; 패키징; 칩내장; 고주파; Alumimum; Anodizing; Packaging; Chip-In; RF; 알루미늄; 양극산화; 패키징; 칩내장; 고주파
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.