DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Young Jin | ko |
dc.contributor.author | Kim, Sung Jin | ko |
dc.date.accessioned | 2024-09-03T10:00:08Z | - |
dc.date.available | 2024-09-03T10:00:08Z | - |
dc.date.created | 2024-08-29 | - |
dc.date.created | 2024-08-29 | - |
dc.date.issued | 2024-06 | - |
dc.identifier.citation | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.224 | - |
dc.identifier.issn | 0017-9310 | - |
dc.identifier.uri | http://hdl.handle.net/10203/322581 | - |
dc.description.abstract | The manifold microchannel (MMC) with pin-fins is fabricated and its thermal-hydraulic performance is experimentally investigated. The MMC with pin-fins is an embedded cooling device made of a manifold wafer and a microchannel wafer, anodically bonded to form a total thickness of 1 mm. A microchannel wafer has the etched micro pin-fins with a porosity of 0.75, fin diameter of 50 mu m, and fin height of 75 mu m. For comparison, MMC with plate-fins is also fabricated, in which the plate-fins have the same porosity, fin thickness, and fin height as the pin-fins. Experiments are performed using single-phase deionized water as the working fluid with flow rates ranging from 50 to 300 ml/min, corresponding to pumping powers ranging from 0.28 to 33 mW, which enables the dissipation of an effective heat flux up to 1.2 kW/cm(2). The experimental results demonstrate that employing pin-fins improves the thermal-hydraulic performance of the MMC heat sinks compared to using the plate-fins: an average 40% reduction in the effective thermal resistance (the total thermal resistance subtracting the conduction resistance) at a fixed pumping power condition. This is attributed to the fact that the MMC with pin-fins exhibits 20% higher heat transfer coefficient and 40% greater effective heat transfer area, even with 25% lower pressure drop on average compared to the MMC with plate-fins. At the highest tested flow rate of 300 ml/min, the MMC with pin-fins successfully dissipates the heat flux of about 1.2 kW/cm(2) without phase-change heat transfer while maintaining the heater temperature below 110(degrees)C. . This is achieved with only 7 mW of pumping power, corresponding to the COP of 41,300 - a 5.3-fold increase in the COP compared to the MMC with plate-fins under the identical heater temperature and the flow rate conditions. Therefore, this study suggests that the MMC with pin-fins is an energy-efficient cooling device for the thermal management of ultra-high heat flux electronics. | - |
dc.language | English | - |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.title | Experimental investigation on thermal-hydraulic performance of manifold microchannel with pin-fins for ultra-high heat flux cooling | - |
dc.type | Article | - |
dc.identifier.wosid | 001202225700001 | - |
dc.identifier.scopusid | 2-s2.0-85185707362 | - |
dc.type.rims | ART | - |
dc.citation.volume | 224 | - |
dc.citation.publicationname | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | - |
dc.identifier.doi | 10.1016/j.ijheatmasstransfer.2024.125336 | - |
dc.contributor.localauthor | Kim, Sung Jin | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Microchannel | - |
dc.subject.keywordAuthor | Manifold microchannel | - |
dc.subject.keywordAuthor | High heat flux cooling | - |
dc.subject.keywordAuthor | Heat sink | - |
dc.subject.keywordAuthor | Thermal management | - |
dc.subject.keywordAuthor | Power electronics | - |
dc.subject.keywordAuthor | Pin-fin | - |
dc.subject.keywordAuthor | Plate-fin | - |
dc.subject.keywordAuthor | Electronics cooling | - |
dc.subject.keywordAuthor | Embedded cooling | - |
dc.subject.keywordPlus | SINK ARRAY | - |
dc.subject.keywordPlus | DESIGN | - |
dc.subject.keywordPlus | FLOW | - |
dc.subject.keywordPlus | OPTIMIZATION | - |
dc.subject.keywordPlus | ELECTRONICS | - |
dc.subject.keywordPlus | MANAGEMENT | - |
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