Softening implantable bioelectronics: Material designs, applications, and future directions
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Oh, Subin | ko |
| dc.contributor.author | Lee, Simok | ko |
| dc.contributor.author | Kim, Sung Woo | ko |
| dc.contributor.author | Kim, Choong Yeon | ko |
| dc.contributor.author | Jeong, Eun Young | ko |
| dc.contributor.author | Lee, Juhyun | ko |
| dc.contributor.author | Kwon, Do A | ko |
| dc.contributor.author | Jeong, Jae-Woong | ko |
| dc.date.accessioned | 2024-06-21T06:00:10Z | - |
| dc.date.available | 2024-06-21T06:00:10Z | - |
| dc.date.created | 2024-06-21 | - |
| dc.date.issued | 2024-08 | - |
| dc.identifier.citation | Biosensors and Bioelectronics, v.258, pp.116328 | - |
| dc.identifier.issn | 0956-5663 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/319918 | - |
| dc.language | English | - |
| dc.publisher | Elsevier BV | - |
| dc.title | Softening implantable bioelectronics: Material designs, applications, and future directions | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 258 | - |
| dc.citation.beginningpage | 116328 | - |
| dc.citation.publicationname | Biosensors and Bioelectronics | - |
| dc.identifier.doi | 10.1016/j.bios.2024.116328 | - |
| dc.contributor.localauthor | Jeong, Jae-Woong | - |
| dc.contributor.nonIdAuthor | Oh, Subin | - |
| dc.contributor.nonIdAuthor | Lee, Simok | - |
| dc.contributor.nonIdAuthor | Kim, Sung Woo | - |
| dc.contributor.nonIdAuthor | Kim, Choong Yeon | - |
| dc.contributor.nonIdAuthor | Jeong, Eun Young | - |
| dc.contributor.nonIdAuthor | Lee, Juhyun | - |
| dc.contributor.nonIdAuthor | Kwon, Do A | - |
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