DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Soo In | ko |
dc.contributor.author | Lee, Kyu Young | ko |
dc.contributor.author | Kim, Joo Young | ko |
dc.contributor.author | Oh, Hwan Won | ko |
dc.contributor.author | Kim, Hyun Woo | ko |
dc.contributor.author | Lee, Chang Woo | ko |
dc.date.accessioned | 2023-12-21T08:00:16Z | - |
dc.date.available | 2023-12-21T08:00:16Z | - |
dc.date.created | 2023-11-28 | - |
dc.date.issued | 2011-08 | - |
dc.identifier.citation | 18th International Conference on Composites Materials, ICCM 2011 | - |
dc.identifier.uri | http://hdl.handle.net/10203/316811 | - |
dc.description.abstract | In semiconductor metallization processes, diffusion barrier is essential for preventing diffusion between metal (Cu: copper) and Si (silicon). However, the Cu has some problems such as easy reaction, poor adhesion, and diffusion into Si. In this study, we suggest tungsten -carbon -nitride (W-C-N) thin films for diffusion barrier that were made by rf magnetron sputtering. Subsequently, heat treatments execute as high temperature up to 800 °C.The films were analyzed continuous stress - strain test according to depth (from surface to Si substrate) by in-situ nano-indenter. The elastic modulus (Er) and hardness (H) of W-C and W-C-N thin films are changed from 152.08 to 168.31 GPa and from 12.05 to 13.2 GPa, respectively. After annealing at 800 °C, the Er and H values are decreased compared with as-deposited state of W-C and W-C-N films from 105.1 to 131.31 GPa and 2.25 to 11.9 GPa, respectively. From the stress - depth graph, the W-C-N thin film was more stable than that of W-C film after annealing up to 800 °C. From these results, the WC-N thin film is more effective to prevent interdiffusion between Cu and Si. | - |
dc.language | English | - |
dc.publisher | International Committee on Composite Materials | - |
dc.title | Stress-strain curves derived from continuous nano-indentation of W-C-N films | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-85076870033 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 18th International Conference on Composites Materials, ICCM 2011 | - |
dc.identifier.conferencecountry | KO | - |
dc.identifier.conferencelocation | Jeju Island | - |
dc.contributor.localauthor | Kim, Hyun Woo | - |
dc.contributor.nonIdAuthor | Kim, Soo In | - |
dc.contributor.nonIdAuthor | Lee, Kyu Young | - |
dc.contributor.nonIdAuthor | Kim, Joo Young | - |
dc.contributor.nonIdAuthor | Oh, Hwan Won | - |
dc.contributor.nonIdAuthor | Lee, Chang Woo | - |
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