DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Subin | ko |
dc.contributor.author | Jeong, Seungtaek | ko |
dc.contributor.author | Sim, Boogyo | ko |
dc.contributor.author | Lee, Seongsoo | ko |
dc.contributor.author | Park, Hyunwook | ko |
dc.contributor.author | Kim, Haeyeon | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2023-09-05T12:00:42Z | - |
dc.date.available | 2023-09-05T12:00:42Z | - |
dc.date.created | 2023-09-05 | - |
dc.date.issued | 2021-07-26 | - |
dc.identifier.citation | 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, pp.498 - 503 | - |
dc.identifier.issn | 2158-110X | - |
dc.identifier.uri | http://hdl.handle.net/10203/312237 | - |
dc.description.abstract | On-package inductor, a promising type of filter inductor for integrated voltage regulator (IVR) requires low loss and shielding structure for high IVR efficiency and vertical noise coupling. In this paper, we proposed a novel on-package inductor of an integrated voltage regulator for high-Q factor and EMI shielding in active interposer based 2.5D/3D ICs. The proposed on-package inductor is composed of 4 parallel spiral loops and a shielding loop. The proposed inductor is verified with simulation and measurement in frequency domain. It achieves both high-Q factor and high shielding effectiveness using the package re-distribution layers only. With its shielding structure, vertical magnetic noise coupling to a noise sensitive circuit block on active interposer is successfully suppressed by 25.5 dB and normal operation of circuit is ensured. | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | Design and Analysis of On-package Inductor of an Integrated Voltage Regulator for High-Q Factor and EMI Shielding in Active Interposer based 2.5D/3D ICs | - |
dc.type | Conference | - |
dc.identifier.wosid | 000861536800114 | - |
dc.identifier.scopusid | 2-s2.0-85118387694 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 498 | - |
dc.citation.endingpage | 503 | - |
dc.citation.publicationname | 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Raleigh, NC | - |
dc.identifier.doi | 10.1109/emc/si/pi/emceurope52599.2021.9559188 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Jeong, Seungtaek | - |
dc.contributor.nonIdAuthor | Sim, Boogyo | - |
dc.contributor.nonIdAuthor | Lee, Seongsoo | - |
dc.contributor.nonIdAuthor | Park, Hyunwook | - |
dc.contributor.nonIdAuthor | Kim, Haeyeon | - |
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