DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yoon, Dal Jin | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2023-08-25T05:00:47Z | - |
dc.date.available | 2023-08-25T05:00:47Z | - |
dc.date.created | 2023-07-06 | - |
dc.date.issued | 2018-05 | - |
dc.identifier.citation | SID Symposium, Seminar, and Exhibition 2018, Display Week 2018, pp.1113 - 1116 | - |
dc.identifier.issn | 0097-966X | - |
dc.identifier.uri | http://hdl.handle.net/10203/311820 | - |
dc.description.abstract | In this study, APL has been introduced into the ACFs system. Then, the effects of APL ACFs properties on the conductive particle movement and interconnection stability of ultra-fine pitch COG applications were investigated. The APL structure can not only significantly suppress the conductive particles movement for ultra-fine pitch COG applications but also prevent electrical short circuit formation between electrodes. After ACFs bonding process, the percentage of captured conductive particles of the conventional ACFs was 33%, however, that of PAN APL ACFs showed 95%. In addition, the APL ACFs showed excellent electrical properties such as stable contact resistance without any open or short circuits. | - |
dc.language | English | - |
dc.publisher | John Wiley and Sons Inc | - |
dc.title | Effects of the Anchoring Polymer Layer (APL) Materials on Conductive Particle Movements for Ultra-Fine Pitch Chip-on-Glass (COG) Interconnection | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-85063068237 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 1113 | - |
dc.citation.endingpage | 1116 | - |
dc.citation.publicationname | SID Symposium, Seminar, and Exhibition 2018, Display Week 2018 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Los Angeles, CA | - |
dc.identifier.doi | 10.1002/SDTP.12117 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
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