Flexible Multi-Modal Sensor for Electronic Skin

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dc.contributor.authorJung, Minhyunko
dc.contributor.authorVishwanath, Sujaya Kumarko
dc.contributor.authorKim, Jihoonko
dc.contributor.authorKo, Dae-Kwanko
dc.contributor.authorPark, Myung-Jinko
dc.contributor.authorLim, Soo-Chulko
dc.contributor.authorJeon, Sanghunko
dc.date.accessioned2023-08-24T11:00:40Z-
dc.date.available2023-08-24T11:00:40Z-
dc.date.created2023-07-06-
dc.date.issued2019-07-
dc.identifier.citation1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019-
dc.identifier.urihttp://hdl.handle.net/10203/311803-
dc.description.abstractFlexible sensors have been developed over the decades due to their potential in various applications. However, recent developments in interactive user interface, healthcare device, tactile sensor, and artificial electronic skin require device with multifunctional properties such as various detection ability and good mobility. Research on such devices are still under developing. In this report, we demonstrate a flexible multimodal (pressure, temperature) sensor using embedded indium tin oxide (ITO). For the pressure sensor, the embedded ITO was adopted as a conductive layer with triple layer pyramid structure. We utilized water-soluble sacrificial layers for eco-friendly method. The triple layer pyramid-structured pressure sensor shows excellent sensitivity in dynamic range of 100 Pa to 10 kPa with high reliability of 105 cycles. For the temperature sensor, we used comb like structure with ITO. It shows negative temperature coefficient on resistance with good linearity. Due to the vertically stacked structure, we were able to ignore interface effect. This work present that the opportunity of transparent electrode towards flexible multimodal sensors that can beemployed for various flexible applications.-
dc.languageEnglish-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleFlexible Multi-Modal Sensor for Electronic Skin-
dc.typeConference-
dc.identifier.wosid000934725900019-
dc.identifier.scopusid2-s2.0-85071356985-
dc.type.rimsCONF-
dc.citation.publicationname1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019-
dc.identifier.conferencecountryUK-
dc.identifier.conferencelocationGlasgow, Scotland-
dc.identifier.doi10.1109/FLEPS.2019.8792246-
dc.contributor.localauthorJeon, Sanghun-
dc.contributor.nonIdAuthorJung, Minhyun-
dc.contributor.nonIdAuthorVishwanath, Sujaya Kumar-
dc.contributor.nonIdAuthorKim, Jihoon-
dc.contributor.nonIdAuthorKo, Dae-Kwan-
dc.contributor.nonIdAuthorPark, Myung-Jin-
dc.contributor.nonIdAuthorLim, Soo-Chul-
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