Bayesian Optimization of High-Speed Channel for Signal Integrity Analysis

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dc.contributor.authorLho, Daehwanko
dc.contributor.authorPark, Junyongko
dc.contributor.authorPark, Hyunwookko
dc.contributor.authorPark, Shinyoungko
dc.contributor.authorKim, SeongGukko
dc.contributor.authorKang, Hyungminko
dc.contributor.authorKim, Subinko
dc.contributor.authorPark, Gap Yeolko
dc.contributor.authorSon, Kyungjuneko
dc.contributor.authorKim, Jounghoko
dc.date.accessioned2023-07-13T02:02:36Z-
dc.date.available2023-07-13T02:02:36Z-
dc.date.created2023-07-07-
dc.date.created2023-07-07-
dc.date.issued2019-10-
dc.identifier.citation28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019-
dc.identifier.urihttp://hdl.handle.net/10203/310481-
dc.description.abstractAs technology advanced, the demand for data bandwidth has been increasing. To meet this demand, the data rate of the channel has been increased, which causes a lot of signal integrity problems. Optimization of the channel is important to solve these problems. Channels are usually optimized with the empirical knowledge of signal integrity designers. However, it is not accurate and requires numerous iterations. On the other hand, a Bayesian optimization method can quickly find optimized parameter values without relying on empirical knowledge. Therefore, this paper proposes a method for optimizing high-speed channel using Bayesian optimization. The proposed method optimizes the frequency response result such as insertion loss, and find the optimal physical dimension parameters. Finally, the optimized results of the proposed method were verified by comparing all the simulation results in the range of the channel.-
dc.languageEnglish-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleBayesian Optimization of High-Speed Channel for Signal Integrity Analysis-
dc.typeConference-
dc.identifier.wosid000570016200041-
dc.identifier.scopusid2-s2.0-85084591240-
dc.type.rimsCONF-
dc.citation.publicationname28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019-
dc.identifier.conferencecountryCN-
dc.identifier.conferencelocationMontreal-
dc.identifier.doi10.1109/EPEPS47316.2019.193211-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorPark, Junyong-
dc.contributor.nonIdAuthorPark, Hyunwook-
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